教育经历
- 2008-09 ~ 2012-07 华东理工大学 化工学院 学士
- 2013-09 ~ 2015-03 bat365的登录入口 bat365在线平台网站 硕士
- 2015-09 ~ 2018-09 早稻田大学 应用化学系 博士
工作经历
- 2017-04 ~ 2018-09 日本学术振兴会JSPS特别研究员
- 2018-10 ~ 2021-12 bat365在线平台网站 助理教授
- 2022-01 ~ 至今 上海bat365在线平台网站 副教授
研究方向
- 集成电路互连材料
- 三维电子封装技术
荣誉信息
- 中表镀-安美特优秀教师奖
- bat365的登录入口优秀团员
- bat365的登录入口优秀团员
- 上海市青年科技英才扬帆计划
- 日本学术振兴会研究奖励金
- 上海市优秀毕业生
论文信息
- [2] W. Hu, Y. Rao, P. Chen, S. Ju, H. Ling, Y. Wu, T. Momma, M. Li, Nano‐Cone Structured Lithiophilic Ni Film on Cu Current Collector Facilitates Li+ Ion Diffusion Toward Uniform Lithium Deposition, Advanced Materials Interfaces, (2022) 2200129.
- [3] W. Hu, Y. Yao, X. Huang, S. Ju, Z. Chen, M. Li, Y. Wu, CuO Nanofilm-Covered Cu Microcone Coating for a Long Cycle Li Metal Anode by In Situ Formed Li2O, ACS Applied Energy Materials, (2022).
- [6] Y. Xia, W. Hu, Y. Yao, S. Chen, S. Ahn, T. Hang, Y. Wu, M. Li, Application of electrodeposited Cu-metal nanoflake structures as 3D current collector in lithium-metal batteries, Nanotechnology, 33 (2022) 245406.
- [1] H. Hu, R. Zhang, Y. Wu, H. Ling, T. Hang, M. Li, Liner Sweep Voltammetry Electroplating Method to Synthesize Large Monocrystalline Cu Cones for Interconnection, Electronic Materials Letters, 18 (2022) 27-35.
- [4] L. Tang, S. Han, P. Chen, T. Hang, H. Ling, Y. Wu, M. Li, Influence of artificial exchange current density on microstructure of Ni films by pulse-reverse electroplating, Materials Chemistry and Physics, (2022) 126338.
- [8] Y. Liu, Y. Han, Y. Wu, L. Xiong, T. Hang, H. Ling, A. Hu, L. Gao, M. Li, Grafting of poly (methacrylic acid-co-acrylamide) film on silicon surface via a simultaneous hydrolysis process, Materials Today Communications, 21 (2019) 100678.
- [5] L.-J. Wei, Z.-H. Zhou, Y.-W. Wu, M. Li, S. Wang, Research Progress of Cobalt Interconnects and its Superfilling by Electroplating in Chips, Journal of Electrochemistry, (2022) 0.
- [9] Y. Liu, Y. Han, L. Xiong, T. Hang, H. Ling, A. Hu, L. Gao, Y. Wu, M. Li, In situ synthesis of a highly cross-linked polymethacrylimide ultrathin film on a silicon wafer with applicable dielectric, thermal, and mechanical properties, Thin Solid Films, 711 (2020) 138308.
- [11] T. Momma, Y. Wu, H. Mikuriya, H. Nara, T. Osaka, In-situ lithiation through an ‘injection’strategy in the pouch type sulfur-graphite battery system, Journal of Power Sources, 430 (2019) 228-232.
- [15] T. Wang, J. Cai, Y. Wu, T. Hang, A. Hu, H. Ling, M. Li, Applicable superamphiphobic Ni/Cu surface with high liquid repellency enabled by the electrochemical-deposited dual-scale structure, ACS applied materials & interfaces, 11 (2019) 11106-11111.
- [7] L. Cao, Y. Wu, T. Hang, M. Li, Fluorine‐Free Nanoporous Low‐k Dielectric Film Covalently Grafted on Si via Aryldiazonium Chemistry, Advanced Materials Interfaces, 8 (2021) 2101127.
- [13] L. Tan, S. Han, S. Chen, T. Hang, H. Ling, Y. Wu, M. Li, The Evolution of Microstructure and Resistance in Electroplated Copper Films by Linear Integrated Laser Scanning Annealing, Electronic Materials Letters, 17 (2021) 207-214.
- [10] Y. Liu, Y. Han, J. Zhang, J. He, T. Hang, L. Gao, Y. Wu, M. Li, Electroless grafting of polymer insulation layers in through-silicon vias, ECS Journal of Solid State Science and Technology, 8 (2019) P591.
- [12] L. Tan, S. Han, S. Chen, T. Hang, H. Ling, Y. Wu, M. Li, The Influence of Leveler on the Impurity Behavior of Electroplated Cu Films During Laser Annealing, Journal of The Electrochemical Society, 168 (2021) 062504.
- [17] Z. Wen, Y. Liu, Y. Wu, T. Hang, M. Li, in: 2020 21st International Conference on Electronic Packaging Technology (ICEPT), IEEE, 2020, pp. 1-4.
- [14] L. Tan, L. Tang, S. Han, S. Chen, T. Hang, H. Ling, Y. Wu, M. Li, Impurity diffusion behavior study of electroplated copper films annealed by linear shaping laser mobile scanning system, Materials Letters, 292 (2021) 129446.
- [16] Z. Wang, X. Long, Y. Wu, M. Li, in: 2020 21st International Conference on Electronic Packaging Technology (ICEPT), IEEE, 2020, pp. 1-4.
- [19] Y. Wu, S. Wang, S. Ju, Z. Zhou, T. Wang, T. Hang, M. Li, Thermal Oxidation Fabricated Copper Oxide Nanotip Arrays with Tunable Wettability and Robust Stability: Implications for Microfluidic Devices and Oil/Water Separation, ACS Applied Nano Materials, 4 (2021) 4713-4720.
- [20] Y. Xia, Y. Wu, L. Wu, T. Wang, T. Hang, Y. Huang, M. Li, Two-Step Electrodeposited 3D Ni Nanocone Supported Au Nanoball Arrays as SERS Substrate, Journal of The Electrochemical Society, 167 (2020) 142502.
- [22] J. Zhang, S. Wang, Y. Wu, B. Fu, Q. Cao, T. Hang, A. Hu, H. Ling, M. Li, Robust CuO micro-cone decorated membrane with superhydrophilicity applied for oil–water separation and anti-viscous-oil fouling, Materials Characterization, 179 (2021) 111387.
- [18] Y. Wu, T. Momma, H. Nara, T. Hang, M. Li, T. Osaka, Synthesis of Lithium Sulfide (Li2S) Wrapped carbon nano composite for binder-free Li2S cathode, Journal of The Electrochemical Society, 167 (2020) 020531.
- [21] Y. Yao, Y. Wu, N. Wang, M. Li, T. Hang, A carbon mixed amorphous-TiSx separator coating for lithium sulfur batteries, Materials Chemistry and Physics, 258 (2021) 123923.
- [23] Z. Zhang, Y. Wu, Y. Zhang, T. Hang, A. Hu, H. Ling, M. Li, Competitive Effect of Leveler's Electrochemical Behavior and Impurity on Electrical Resistance of Electroplated Copper, Journal of The Electrochemical Society, 166 (2019) D577.